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Wiskind attended the China International Semiconductor Packaging and Testing Conference
2024-03-20
On March 19, 2024, the China International Semiconductor Packaging and Testing Conference was successfully held in Shanghai. This conference has the theme of "Gathering Cores, Empowering Domestic Products, Advanced Packaging and Testing, and Creating the Future of Cores". This conference brings together semiconductor packaging and testing Top experts, scholars, and outstanding companies in the ind...